Tender for Lagging And Thermal Insulation With Materials For Exhaust And Vapor Pipelines, - Haryana Board Corporation

The Haryana Board Corporation, based in Palwal, Haryana, has issued a tender on the eProcure portal, identified by Tender ID 2026_Hbc_555246_1. This tender seeks the Lagging And Thermal Insulation With Materials For Exhaust And Vapor Pipelines, Pan Bodies, Evaporator Bodies, Juice Sulphitor, Juice Heaters And V.L. Juice Heaters, Boiler Ducting And Associated Pipelines. The deadline for bid submission is 27 Oct 2026. Interested bidders can access the complete tender details and download the necessary documents from the eProcure portal to participate in this procurement opportunity. Ensure to review all specifications and requirements thoroughly to submit a compliant and competitive bid.