Tender for Wire Bond Removal From Bga Packaged Semiconductor Chips - Centre For Development Of Advanced Computing

The Centre For Development Of Advanced Computing, based in Thiruvananthapuram, Kerala, has issued a tender on the GeM portal, identified by Tender ID Gem/2026/B/7936231. This tender seeks the Wire Bond Removal From Bga-Packaged Semiconductor Chips. The deadline for bid submission is 04 Sep 2026. Interested bidders can access the complete tender details and download the necessary documents from the GeM portal to participate in this procurement opportunity. Ensure to review all specifications and requirements thoroughly to submit a compliant and competitive bid.