Tender for Manual Wire Bonder And Kits - Indian Institute Of Technology

The Indian Institute Of Technology, based in Midnapore, West Bengal, has issued a tender on the eProcure portal, identified by Tender ID 2025_Iitkg_888131_1. This tender seeks the Manual Wire Bonder And Kits. The deadline for bid submission is 24 Dec 2025. Interested bidders can access the complete tender details and download the necessary documents from the eProcure portal to participate in this procurement opportunity. Ensure to review all specifications and requirements thoroughly to submit a compliant and competitive bid.