Tender for Supply Of Thermal Compound Paste Use In Coolers Heat Sink For Cpu And - Ministry Of Civil Aviation

The Ministry Of Civil Aviation, based in Mumbai, Maharashtra, has issued a tender on the GeM portal, identified by Tender ID Gem/2025/B/6787340. This tender seeks the Supply Of Thermal Compound Paste Use In Coolers Heat Sink For Cpu And Chip-Sets. The deadline for bid submission is 24 Oct 2025. Interested bidders can access the complete tender details and download the necessary documents from the GeM portal to participate in this procurement opportunity. Ensure to review all specifications and requirements thoroughly to submit a compliant and competitive bid.