Tender for Accessories For Wire Bonding Machines - Ministry Of Electronics And Information Technology

The Ministry Of Electronics And Information Technology, based in Saltlake, West Bengal, has issued a tender on the eProcure portal, identified by Tender ID 2025_Deit_810416_1. This tender seeks the Accessories For Wire Bonding Machines. The deadline for bid submission is 02 Sep 2025. Interested bidders can access the complete tender details and download the necessary documents from the eProcure portal to participate in this procurement opportunity. Ensure to review all specifications and requirements thoroughly to submit a compliant and competitive bid.