Tender for Construction Of Box Culvert Between Sy No And Sy No In Technopark Phase - Electronics Technology Parks

The Electronics Technology Parks, based in Thiruvananthapuram, Kerala, has issued a tender on the eProcure portal, identified by Tender ID 2024_Etpk_678687_1. This tender seeks the Construction Of Box Culvert Between Sy No 339 And Sy No 343 In Technopark Phase 3 Campus, Trivandrum. The deadline for bid submission is 19 Jul 2024. Interested bidders can access the complete tender details and download the necessary documents from the eProcure portal to participate in this procurement opportunity. Ensure to review all specifications and requirements thoroughly to submit a compliant and competitive bid.

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Work Description:

Construction Of Box Culvert Between Sy No 339 And Sy No 343 In Technopark Phase 3 Campus, Trivandrum

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