ELECTRONICS TECHNOLOGY PARKS Tender Result

TENDER AWARD DETAILS

finishing the existing floor with two layers of grinding with diamond impregnated stones of 36 60 & 120 200 respectively. after completion of two layer of grinding the potholes should be filled with non-shrink grout/ micro concrete after applying the bonding agent. after filling the potholes, the surface is to be grinded with ceramic grit pad number 60 & 100, after which lithium silicate densifier is to be applied up to the saturation in two coats, again silica-based densifier is applied. after the above procedure the surface is to be polished with ceramic grid diamond pad number 200 & 400 & application of stain protector cum sealer to be carried out before buffing the surface with high speed burnisher. the rate inclusive of all material charge, labour, transportation, scaffolding (if needed) loading/ unloading at the work space, chipping, cleaning, removal of debris from the site, barricading the premises, etc. complete as per the direction of engineer in charge.

  • CITY & STATE
    Thiruvananthapuram, Kerala
  • RESULT ID:
    812439
  • CONTRACT AMOUNT:
    21.50 Lac
  • CONTRACT Date:
    04 Jan 2023
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